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Today, most integrated circuits (ICs) are made of silicon. Turning silicon into memory chips is an exacting, meticulous procedure involving engineers, metallurgists, chemists and physicists. The first step from silicon to circuit is the creation of a pure, single-crystal cylinder or ingot of silicon six to eight inches in diameter. These cylinders are sliced into thin, highly polished silicon wafer 4 inch less than one-fortieth of an inch thick. Micron uses six- and eight-inch silicon wafer 4 inch. The circuit elements (transistors, resistors, and capacitors) are built in layers on the silicon wafer. Hundreds of memory chips are etched onto each silicon wafer 6 inch.
CZ-SSP-6"-P-Boron, Diameter: 6" , Type Dopant: P-Boron, Thickness: 675um, Single Crystal Silicon Wafer
