Layers: 2 layer? to 16 layer to the main circuit board to a maximum of 22 layers; ?Material: FR-4, Ceramic, Teflon, aluminum plate and other materials, halogen-free materials. ?Minimum finished diameter: ¢ 0.2mm; ?Minimum Line Width / Space 0.075/0.075mm; (3mil/3mil) Thickness: 0.4 ~ 3.2mm; Copper thickness: 0.5 ~ 5OZ; Impedance: 100 ± 10%, 60 ± 10%, 28 ± 10%; differential impedance; ?Surface: OSP, EING, Immersion Tin, and Immersion silver,HASL and Lead free HASL,are all adhere to the RoHS Directive requirements
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